TWILIGHT TECHNOLOGY, INC.

      Twilight Technology Inc. has introduced a new packaging program designed exclusively for the Space market sector to address the critical demand for higher memory densities in smaller spaces.  This program leverages Twilight’s patented and versatile, Ceramic Leadless Chip Carrier to build compact, reliable hermetic solutions for large memory arrays or solid-state recorders.  Each die is individually packaged, screened and tested before being assembled into a space saving stack.  This method optimizes yield, provides rework capability and ultimately lowers overall cost versus MCM’s.  Twilight’s VersaStack® Program is a turnkey packaging solution that can be easily applied to any choice of memory die.

How Twilight’s VersaStack® Program works:

-          The customer specifies and/or supplies the die, configuration and density requirements.

-          Twilight supplies and supports the Stackable Leadless Chip Carrier (SLCC) packages, lids, leading, assembling, screening and stacking  the SLCC’s*.

-          Twilight also screens and tests each SLCC level, electrically tests the assembled stack, and provides final inspection for compliance to customer source control drawings and qualification/quality conformance test requirements.

* May be performed by customer or customer’s approved supplier

Twilight’s VersaStack® features:

• Hermetically sealed and reworkable packaging
• Economic use of precious board space
• Custom assembly and screening flows if required
• Flexible Memory Technologies (i.e., SRAM, EEPROM, SDRAM, etc.)
• Memory density and configuration per your specifications

For more information, please call Tobias McCurry at 714-257-2257