Nitrogen Die Banking
As the problem of component obsolescence increases, die banking has become a low cost, effective solution to guarantee component supply for long product life programs. The die banking service supplies and stores die in controlled conditions until the wafers (raw die) are cut into individual die for final packaging and test.
With the component cost at its most basic level, package flexibility becomes a viable option, also allowing for current product date codes (when stored correctly, silicon will not have any wear-out mechanism).
With no design intervention or re-qualification from your engineering department, our customers are assured the same manufactured product without fear of poor solderability, moisture migration, and package degradation.